| 摘要 |
PURPOSE: To precisely process a thin film formed on a substrate without remaining the parts which is not processed and without applying processing damage on a work piece by acting a phase mask on a beam to apply deformation to the intensity distribution of the beam, then irradiating the work piece with the beam. CONSTITUTION: The beam emitted from the laser oscillator is expanded by an expander collimator 103 and is made incident on the phase mask 104. This phase mask 104 has the effect of converting the gaussian intensity distribution of the incident beam to the intensity distribution of a rectangular shape. The beam transmitted through the phase mask 104 forms a light condensing spot 109 on the surface of the work piece 107 held on a moving stage 108 via a condenser lens 106. The work piece 107 is moved by the moving stage 108, by which the prescribed part is processed. A precision x-y stage 105 is used for aligning the symmetrical center of the phase distribution of the phase mask 104 and the center of the beam. |
