| 摘要 |
An electronic circuit package comprises a carrier substrate 20 e.g. in the form of a flexible circuit, having a plurality of electrical contacts 40 - 45 defined thereon, an integrated circuit device 10 mounted on the substrate including a plurality of terminals 30, 32, 50 - 54 located towards the periphery of the device, the plurality of terminals being individually connected by means of conductive wires 31 to a corresponding electrical contact on the substrate. The package further comprises a conductive path means 150 acting as a conductive bridge between a selected device terminal eg 50 and an associated electrical contact on the substrate 43, the conductive path means comprising a conductive region defined in or on an outward facing surface of the device, the selected terminal eg 50 connected by a first conductive wire 180 to the conductive region 162, 166 which is in turn connected by a second conductive wire 182 to the associated electrical contact 108. The conductive region is advantageously formed in a separate circuit element e.g. a flexible circuit which is bonded onto the surface of the device. <IMAGE> |
