Integrated circuit chip connection system of cranked leads
摘要
Integrated circuit chip connection leads (8) are formed of conducting material with good mechanical strength. The leads (8) consist of an extended strip (5) with a fixing pad (6) connecting to a corresponding attachment pad on chip. The lower end of lead is cranked at 90 degrees to the plane of the lead (8) array. Leads are fixed by adhesive to horizontal insulating strips (3) held in kapton foil.
申请公布号
DE4429002(A1)
申请公布日期
1996.02.22
申请号
DE19944429002
申请日期
1994.08.16
申请人
SIEMENS NIXDORF INFORMATIONSSYSTEME AG, 33106 PADERBORN, DE