| 摘要 |
<p>In a method for manufacturing a III-V nitride compound semiconductor light emitting element, light emitting element regions (21) are formed in a low dislocation region on the III-V nitride compound semiconductor substrate wherein high density dislocation sections (22) and low dislocation regions are alternately arranged repeatedly, so that stripe-shaped light emitting regions are in parallel to the direction wherein the high density dislocation sections (22) extend, and then the substrate is broken, after making two scribe lines (23) to have the high density dislocation section (22) in between, on a plane (25) on the opposite side to a plane (24) whereupon the element regions (21) are formed. Thus, chips are separated and the high density dislocation sections (22) can be removed. The pitch of the two scribe lines is preferably 100µm or more. Thus, the method for manufacturing the III-V nitride compound semiconductor light emitting element by which the high density dislocation section can be surely removed without generating chipping or the like in the outer shape and junction down mounting/flip chip mounting can be performed is provided.</p> |
