| 摘要 |
<p>An omni-directional non-occluding solder pad (40) design for printed circuit boards (10) comprising a plurality of spokes (42) radiating outward from a through-hole (16) on the printed circuit board (10), with a ring (44) concentric to the through-hole that intersects each of the plurality of spokes at approximately a perpendicular angle. The ringed-spoke configuration eliminates the need to ensure proper orientation of the solder pad (40) on the printed circuit board (10) prior to a wave soldering process since the symmetrical ringed-spoke design is omni-directional. The concentric ring structure provides an additional contact area of solder between the printed circuit board and a computer chassis (12). This additional contact area of solder ensures that there is sufficient electical connection between the printed circuit board (10) and the computer chassis (12) such that when the printed circuit board (10) is mounted to the computer chassis (12), a proper grounding connection is provided.</p> |
