| 摘要 |
<p>PURPOSE:To obtain a symmetrical surge resistance depending upon no polarity by holding and soft-soldering a conductive spacer between a lead wire and a semiconductor chip in a bi-directional surge absorbing element. CONSTITUTION:One main surface of a semiconductor chip 1 is bonded with a lead frame 2 through soft solder 4, the other main surface of the semiconductor chip 1 and a conductive spacer 6 are cemented through the soft solder 4, and the conductive spacer 6 and a lead wire 3 are bonded through the soft solder 4.</p> |
