发明名称 WIRING PROCESSOR FOR MULTILAYER PRINTED BOARD
摘要 <p>PURPOSE:To surely form wiring on the wiring layers of the same impedance by selecting two wiring layers of the same impedance of a multilayer printed board and forming a wiring pattern within the limit of the pair of the layers. CONSTITUTION:Based on data D3 for indicating the impedance of the respective wiring layers of the multilayer printed board, two wiring layers of the same impedance are selected and set as the pair layers. Then, based on parts arrangement data D2, whether or not a wiring object is the signal pin of a high-speed element is judged and the wiring between the signal pins is performed based on circuit connection data D1 in the case of the signal pin of the high-speed element. In this case, the wiring pattern is formed by using the set pair layers of the same impedance. Then, at the point of time when the wiring of the signal pins of the high-speed element is completed, whether or not the wiring is formed within the limit of the pair layers is checked. As the result of the wiring check, when the error of a wiring route is detected, the wiring is performed again.</p>
申请公布号 JPH0850607(A) 申请公布日期 1996.02.20
申请号 JP19940185050 申请日期 1994.08.08
申请人 NEC COMMUN SYST LTD 发明人 HORI MIEKO
分类号 H05K3/46;G06F17/50;(IPC1-7):G06F17/50 主分类号 H05K3/46
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