| 摘要 |
An electronic device operating in the microwave frequency range having components disposed in a plurality of planes, wherein the planes are stacked vertically. The electronic device is a T/R module or element forming a part of a subarray used in an active array radar. The T/R module or element comprises a transmit chip, a receive chip, low noise amplifiers, a phase shifter, an attenuator, switches, dc power supply, interconnects that interconnect the foregoing components and logic circuits to control the foregoing components. The components when stacked in a 3-D package are disposed behind a radiator or antenna, which transmits and receives the microwave signals. Behind the T/R module or element is a manifold which provides input and output to and from the T/R module or element. The microwave chips of the T/R module are monolithic microwave integrated circuit chips and control logic, which are disposed in an aluminum nitride substrate and coated with a conformal hermetic coating. The 3-D chip package can optionally include micro channel cooling by adding additional layers. The integrated circuits also employ a flip chip design for mounting to the wafers. Optional photonic interconnects could be used for communication between levels in the 3-D package and can be used between subarrays as a manifold.
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