| 摘要 |
PURPOSE: To leave a protective metallic foil in the surrounding of a circuit pattern during an inner layer processing for applying intensity to a panel by providing a hole for deciding a position in a circuit pattern, replacing an inoperating circuit pattern with an operative circuit pattern, and fixing the operative circuit pattern in the panel. CONSTITUTION: After the positioning of a matching hole, the outline of the position of a circuit pattern to be positioned is drawn, and both protecting foil layers 18 and 20 and copper film layers 14 and 16 are etching-carried out and pierced in the pattern arranged in the panel matching hole. Etching-carried out grooves 54 and 56 carry out the etching of the films layers 14 and 16 and the protecting foil layers 18 and 20, and pass through them. Afterwards, the protective foil layers in the outline of the etching-carried out grooves 54 and 56 are removed from the both sides, and the copper film layers 14 and 16 for the etching of the circuit pattern are exposed. Then, the circuit pattern is formed after the normal photoresist exposure, phenomenon, and etching of a printed wiring board panel is ended. |
