| 摘要 |
PURPOSE:To provide a multilayer printed wiring board in which the diameters of a through hole and a via hole are reduced, further a fine pattern can be achieved due to narrowing of a circuit or a circuit spacing, and at the same time the metal conductor of a conductor circuit layer is firmly joined to a resin insulation layer. CONSTITUTION:In a multilayer printed wiring board where a conductor circuit layer is laminated via a resin insulation layer, the lamination part of a metal conductor constituting of an inner-layer patter out of the conductor circuit layer forms a rough surface (recessed and projecting surface), a projecting coating 100-10,000Angstrom thickness is formed on the rough surface (recessed and projecting surface), and the oxidized film surface is chemically activated by coupling treatment. |
