发明名称 Method for fabricating a stacked capacitor cell in semiconductor memory device
摘要 There are disclosed a semiconductor memory device and a method for fabrication thereof. The semiconductor memory device comprises a storage electrode connected with a source region of a MOSFET and formed with a wider area than that of the mask therefor, having a structure which is comprised of a spacer-shaped hollow cylinder of impurity-doped polysilicon containing three separate solid cylinders of impurity-doped polysilicon therein, a column filling the contact hole, and a disc-like plate, the spacer-shaped hollow cylinder and the three separate cylinders standing on the disc-like plate from which the column is extended toward the active region. It has an advantage of increasing the efficient area of a storage electrode of a semiconductor device, thereby improving the capacitance. In addition, it becomes more reliable and thus, its price increases.
申请公布号 US5492850(A) 申请公布日期 1996.02.20
申请号 US19940366827 申请日期 1994.12.30
申请人 HYUNDAI ELECTRONICS INDUSTRIES CO., LTD. 发明人 RYOU, EUI K.
分类号 H01L27/04;H01L21/822;H01L21/8242;H01L27/108;(IPC1-7):H01L21/70;H01L27/00 主分类号 H01L27/04
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