发明名称 PERFORATION PROCESSING OF PRINTED BOARD AND METHOD OF MOUNTING COMPONENT
摘要 PURPOSE:To bore a hole, to which the leads of a component are connected, simply in a printed board. CONSTITUTION:In a method of perforating a printed board 1A formed by laminating a conductor foil 4 on the surface of a plate 3 consisting of an insulating material, a blind hole 8 is formed in the back of a perforating position on the foil 4 by removing the insulating material and perforating and burring processing of the foil 8 are performed by pressing the foil 4 from the side of the surface of the foil 4 to the side of the hole 8.
申请公布号 JPH0846321(A) 申请公布日期 1996.02.16
申请号 JP19940176616 申请日期 1994.07.28
申请人 YAZAKI CORP 发明人 OSHIMA TAKESHI
分类号 B26F1/00;B23K26/00;B23K26/38;B23K101/42;H05K1/03;H05K1/18;H05K3/00;H05K3/40 主分类号 B26F1/00
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