| 摘要 |
PURPOSE:To decrease the number of times for designing a new package, lead frame or TAB tape by forming bonding pads to be connected with bonding wires while matching with the stitch of a lead frame after determination. CONSTITUTION:A product and a package to be used are read out from art input data 40 at Step 41. A library is then searched based on the results thus read out at Step 42 and a bonding pad data is extracted at Step 43 before pads are formed at placement and routing step 44. The library stores a pad data, e.g. the name of master chip, regions where placement of package and pads is allowed and inhibited, and the artwork data of bonding pad. The artwork data and the data of allowed and inhibited regions are outputted from Step 43 for extracting the bonding pad data. |
