| 摘要 |
PURPOSE:To provide a method of manufacturing a printed wiring board, which enhances the general-purpose properties of the board and can obtain a high- density wiring. CONSTITUTION:A board 1 of a structure, wherein a plurality of sheets of thin plates 6 are laminated and hole filling materials 7 are respectively filled in holes 2, is formed. Then, a resin 14 is applied on the whole surfaces other than parts, in which a hole 2 is bored, of both of the surface and rear of the board 1 and the exposed hole filling material 7 is dissolved, is separated from the board 1 and the hole 2 is bored. Then, a conductor plated layer 3 is formed on both of the surface and rear of the board 1 and the wall surface of the hole 2 and this layer 3 is etched to form a conductor pattern 4. |
