| 摘要 |
<p>PURPOSE:To prevent corrosion of wiring patterns by the alkaline component in solder and to eliminate conduction defects by packaging a noise absorber formed by packaging electronic parts, such as capacitors and resistors, via adhesives, such as resins, onto a glass substrate. CONSTITUTION:The electronic parts 7, etc., consisting of an effective display part, a driver IC for driving and chip type capacitor are formed a glass substrate 2. The electronic parts 7 are fixed onto the glass substrate 2 via the adhesives 7a of the epoxy resin. Conductive patterns 8 and power source lines 9 are formed by a thin film technique around the electronic parts 7. The electrode parts and conductive patterns 8 of the electronic parts 7 are connected by wire bonding 10. Further, the conductive patterns 8 and the power source lines 9 are connected by wire bonding 11, 12. As a result, not only the corrosion of the wiring patterns but the generation of the conduction defects by solder flow and silver vibration, etc., also are prevented.</p> |
