| 摘要 |
PURPOSE:To enhance the moisture resistance of a resin sealed semiconductor device by partially exposing the surface of an electrode and forming a resin film on the surface of a semiconductor chip and then placing a solder between a conductive member and the electrode. CONSTITUTION:A plurality of pads 5, formed independently on the surface of a semiconductor chip 2, are exposed partially and a resin film, i.e., a passivation film 3, is formed on the surface of the semiconductor chip 2. In other words, the surface of the pad 5 is covered, on the fringe part thereof, with the passivation film 3 and a conductive film 4 is bonded, through a solder bump 6, to the exposed part of each pad 5 for the purpose of electric connection with the outside. Consequently, the solder bump 6 has a face to be bonded with the pad 5, a face to be adhered to a seal resin 1, and a face to be adhered to the passivation film 3. The conductive film 4 has a part protruding outward from the surface of the seal resin 1. The conductive film 4 is arranged in at least two rows along the long side of the semiconductor device. |
