Verfahren zur Herstellung mikroelektronischer Gehäuse mit Kupfersubstrat

摘要

Disclosed is a method of fabricating a microelectronic package having least one layer formed of a copper surface core (1), e.g., a copper-Invar-copper core, with a polymeric dielectric film (5). The method includes removing copper oxide from the copper surface (2,3) of the metallic core or layer. After this step an adhesion layer (4,4'), as a chromium layer, a nickel layer, or chromium and nickel or chromium and copper bilayers, is sputter deposited onto the copper surface of metallic core or layer. A polymeric dielectric film (5) is then applied atop the metallic adhesion layer.