| 发明名称 |
WAFER PROBING METHOD |
| 摘要 |
a) searching the target when the wafer is loaded; b) assigning the first die; c) performing probe and alignment automatically; d) assigning the second position; e) searching the second position of pattern die; and f) performing the (b) step after the step(e).
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| 申请公布号 |
KR960002288(B1) |
申请公布日期 |
1996.02.14 |
| 申请号 |
KR19920018795 |
申请日期 |
1992.10.13 |
| 申请人 |
HYUNDAI ELECTRONICS IND. CO., LTD. |
发明人 |
KIM, DONG - SUB |
| 分类号 |
H01L21/66;(IPC1-7):H01L21/66 |
主分类号 |
H01L21/66 |
| 代理机构 |
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