| 摘要 |
An integrated circuit package, as well as a method for fabricating the same, is herein disclosed. The integrated circuit package of the present invention includes a cavity located within an assembly of laminated printed wiring boards. Such cavity provides two or more bonding tiers for connection with a semiconductor die. The contact pads are further connected, through conductive vias, to external connection means such as solder balls or pins. The semiconductor die is encapsulated with a molding compound through a transfer molding process. The present invention is especially advantageous in manufacturing pin grid array ("PGA") and ball grid array ("BGA")integrated circuit packages.
|
