DEVICE AND METHOD FOR SUPPLYING SEMICONDUCTOR CHIP

摘要

PURPOSE:To strip off semiconductor chips from an adhesive sheet without operating a suction collet and thrusting-up needles synchronously. CONSTITUTION:A semiconductor supplying device is provided with a suction ring 9 which holds an adhesive sheet 2 by suction from the lower surface side of the sheet 2 in a state where the semiconductor chip 3 sticking surface of the sheet 2 is maintained on the upside, thrusting-up needles 10 which are provided so that their tips can be brought nearer to the lower surface of the sheet 2, and a driving mechanism which lowers the ring 9 and sheet 3 which is held by the ring 9 by suction against the needles 10, and a suction collet 4 which attracts and transfers the chips 3 stripped off from the sheet 2 by means of the needles 10 thrust up the chips 3 from the sheet 2.