| 摘要 |
PURPOSE:To improve the throughput of a multilayered circuit board manufacturing method and to form a fine via having a high aspect ratio and, at the same time, to prevent the occurrence of delamination. CONSTITUTION:A multilayered circuit board manufacturing method includes a process for forming a via hole 5 through an insulating film 3 and another process for forming a via 8 composed of a melt of superfine metallic particles in the hole 5 by removing a solvent through heat treatment and melting the superfihe metallic particles after paste 7 prepared by diffusing the superfine metallic particles in the solvent is applied to the insulating film 3. |
