| 摘要 |
<p>PURPOSE:To reduce the size and thickness of a multilayered wiring board with cavity and, at the same time, to form recessed hole with high accuracy by forming wiring on the bottom of a cavity on the opposite side of a semiconductor chip mounting surface and insulating the wiring from a semiconductor chip with an insulating layer. CONSTITUTION:A cavity for mounting a semiconductor chip 12 is provided in the inner-layer wiring forming material of a substrate and wiring is formed on the bottom of the cavity on the opposite side of a semiconductor chip 12 mounting surface. The wiring is insulated from the chip 12 with an insulating resin layer. In addition, interlayer connecting holes 3 are provided through the bottom of the cavity for electrically connecting the wiring which is flush with the wring layer in the cavity section to wiring immediately below the wiring. At the time of alternately laminating and sticking layers of the inner- layer wiring forming material and adhesive metallic foil 1 upon another and to each other, at least a mold releasing layer which does not stick to the inner wiring forming material is interposed between each layer of the material and foil 1 in a specific section. Therefore, a wiring board with cavity having a small size and thin thickness can be easily manufactured.</p> |
