| 摘要 |
PURPOSE:To obtain a wire bonder in which the quality is stabilized while enhancing mass productivity. CONSTITUTION:When a wire 3 is bonded to a semiconductor chip 1, a holding circuit 13 stores the displacement of an oscillator 5 until a ball 3b comes into contact with the semiconductor chip 1. A subtractor 14 then subtracts the output of a converter 11 from the output of the holding circuit 13 thus determining the collapse of the ball. When the collapse of the ball reaches a preset value Vs, a controller 16 interrupts the operation of an ultrasonic oscillator 7 and the oscillator 5 is pulled up again by means of a motor 6. |
