| 摘要 |
<p>PURPOSE:To provide a board which is excellent in high frequency property and is capable of high-density mounting and is suitable for small-sized light- weight electronic apparatus. CONSTITUTION:This is a multilayer copper-clad laminated board 10 with a built-in capacitor being constituted by laying a second prepreg 8 and an outer layer copper foil 9 on top of each other of an inner-layer board 7, where an inner-layer circuit 6 is made by processing a copper-lined laminated 5 with a built-in capacitor being constituted by laying copper foils 2 on both sides of the first prepreg 1 provided with a hole wherein high dielectric ceramic 4 is bonded by preheating, and then, pressurizing and heating them all together thereby uniting them. Moreover, this is a copper-clad laminated board 5 with a built-in capacitor used for the manufacture of the multilayer copper-clad laminated board.</p> |
