| 摘要 |
PURPOSE:To accurately judge adequacy of junction for bonding a wire without influence of material change of a bonding pad by judging the junction to be good when a ratio of the amount of regular reflection and irregular reflection of a reflected light beam at the surface of the bonding pad. CONSTITUTION:The surface of bonding pad 3a to which a bonding wire is joined is irradiated with a light beam and adequacy of junction of bonding pad 3a for the bonding wire is judged from the amount of reflected light beam. In this case, a ratio of the amount of regular reflection and the amount of irregular reflection of the reflected light beam at the surface of bonding pad 3a is obtained. When the ratio is within the allowable range, the junction of the bonding pad 3a for the bonding wire is judged good. Moreover, the ratio is not in the allowable range, the junction of bonding pad 3 is judged to be unacceptable. For instance, the amount of the reflected light beam is measured using a CCD camera 20. |
