| 摘要 |
<p>PURPOSE:To provide a semiconductor device having a protection cap of high quality for protecting an IC chip, a bonding wire or the like from pressure of mold resin, and its manufacturing method. CONSTITUTION:A protection cap 5 for coating an IC chip 1, a die pad 2, a part of a lead 3 and a bonding wire 4 is fitted and nitrogen or inactive gas is sealed into the protection cap 5, which is sealed with mold resin 6 therefrom.</p> |
