Verfahren zur Einkapselung einer Halbleitervorrichtung.

摘要

A semiconductor device is fabricated by placing a semiconductor chip (7) in a lead frame which has no die pad. Electrodes of the chip are connected by bonding wires to respective lead fingers (3). Additionally, the lead frame has movement restricting fingers which limit horizontal movement of the chip within the lead frame during injection of resin into a mould surrounding the chip. Furthermore, the mould has horizontal movement restricting projections (12) to limit vertical movement of the chip within the mould cavity. The restriction on horizontal and vertical movement of the chip reduces the risk of the bonding wires being broken or short circuited during the resin injection process.