发明名称 PLATE POLISHING DEVICE
摘要 PURPOSE:To improve the uniformity of a polished surface by holding a plate with a holding member, shifting it to the machining position into pressure contact with a continuously shifted abrasive tape, rotating the abrasive tape for polishing, retreating the holding member, separating the plate from the abrasive tape, and shifting it to the extracting position. CONSTITUTION:A support base 5 and a machining bed 10 are lowered by the drive of a vertically moving motor 8 at the feeding position, and a plate W is sucked and held by a holding member 15. The plate W is lifted, and it is moved to the machining position N by a moving motor 13. An abrasive tape T is continuously shifted by a tape shifting mechanism 42 kept in the horizontally rotating state at the machining position N. The planetary motion of rotation and revolution is applied to the holding member 15 by a rotating mechanism 16. The holding member 15 is again lowered, and the plate W is pressed to the abrasive tape T for polishing. The holding member 15 is lifted after polishing, the plate W is moved to the extracting position, and it is extracted and shifted by an extracting/indexing table 3.
申请公布号 JPH0825206(A) 申请公布日期 1996.01.30
申请号 JP19940180631 申请日期 1994.07.08
申请人 SANSHIN:KK 发明人 HOSOGAI NOBUKAZU
分类号 B24B21/00;B24B21/04;(IPC1-7):B24B21/04 主分类号 B24B21/00
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