| 摘要 |
<p>PURPOSE:To promote the compactification of a conveyor system as preventing the sticking any scratch and dust to a wafer in time of conveyance by forming each suction layer successively in space between an opposed surface continuing this surface in the conveying direction of a thin plate and the wafer, and making the wafer alone conveyable. CONSTITUTION:An opposed surface 11 is set up so as to be opposed to a top surface 3a of a wafer 3, and this opposed surface 11 is continuously installed in the conveying direction of the wafer 3. Six supply openings 12a, 12b, 12c, 12d, 12e and 12f are installed in the opposed surface 11 so as to make each suction layer be formed in space between this opposed surface 11 and the wafer 3 successively in the conveying direction of the wafer 3. Subsequently, these supply openings 12a, 12b, 12c, 12d, 12e and 12f are installed in a row at a shorter space than length in the conveying direction of the wafer 3.</p> |
