LEAD FRAME AND SEMICONDUCTOR DEVICE USING IT

摘要

PURPOSE:To surely protect a package against cracking caused by a thermal stress induced at solder reflow. CONSTITUTION:Four slits 8 are provided to a die pad 4 penetrating it in its thicknesswise direction so as to draw a cross-shaped form on the surface of a lead frame, and a space L between the end of the slit 8 nearest to the periphery of the die pad 4 and the periphery of the die pad 4 is set below 1mm, whereby a stress generated in the die pad 4 is dispersed, and resin is enhanced in adhesive strength to a semiconductor chip.