| 摘要 |
PURPOSE:To prevent holes from remaining in a via of a high-melting point conductive material, in which a low-melting point, low-resistance conductive material is impregnated, in regard to a multilayer ceramic substrate and its manufacturing method. CONSTITUTION:A multilayer ceramic substrate 25 has a ceramic layer 21 and a via 26 piercing through this ceramic layer 21 in the thickness direction. A via 26 in W, which will become a high-melting point conductive material, is impregnated, at a lower melting point than this W, with Cu 24, which will become a low-melting point, low resistance material with a lower electric resistance than W. A projecting part 26a protruding in the surface direction of the ceramic layer 21 is provided at a prescribed thickness in the via 26. |
