发明名称 CHIP SOLID ELECTROLYTIC CAPACITOR AND MANUFACTURE THREOF
摘要 PURPOSE:To make it possible to mount a plurality of kinds of capacitor elements, which are different in external size, by a common lead frame having one kind of a terminal structure. CONSTITUTION:In a chip solid electrolytic capacitor of a constitution that an anode metal terminal 10 and a cathode metal terminal 4 with the point part bent into a step form are made to arrange in opposition to each other and an electrode extraction layer 5 of a capacitor element and an anode lead 2 of the capacitor element are respectively bonded on the bent inner surface of the terminal 4 and to the electrode 10 and are mounted to the terminals 4 and 10, the point part 10a of the terminal 10, which is bonded to the element, is flexibly formed and the terminal 10 is bendably bonded to the lead 2.
申请公布号 JPH0822933(A) 申请公布日期 1996.01.23
申请号 JP19940154024 申请日期 1994.07.06
申请人 NEC KANSAI LTD 发明人 SUZUYAMA YASUHIRO
分类号 H01G9/012;H01G9/15;H01G13/00 主分类号 H01G9/012
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