| 摘要 |
PURPOSE:To provide a method which allows excellent cost performance, productivity and dimension accuracy for sealing an electronic component. CONSTITUTION:An IC chip 7, which is an electronic component, is mounted on a substrate 1 for mounting electronic component. Sealing resin 26 is printed on the substrate 1 using a metal mask, and whole plane of the IC chip 7 is covered. Then, the printed sealing resin 26 is heat-cured. The top plane of the cured sealing resin 26 is ground by a surface grinder 8, and the sealing resin 26 is permitted to have a prescribed thickness. |
