MULTILAYER PRINTED WIRING BOARD AND METHOD OF MANUFACTURE

摘要

PURPOSE:To provide connecting terminals to avoid mismatching of characteristic impedance at the connecting part of a printed wiring board that is provided with a strip circuit structure for matching the characteristic impedance. CONSTITUTION:At an edge surface 2 of a multilayer printed wiring board, a signal terminal pad 4a and a ground pad 4b that is connected with a ground layer are exposed. A structure is provided in which cutouts 5 where the surfaces of the signal terminal pad 4a are exposed at the insulation layer of the edge surface 2 of the multilayer printed wiring board and coaxial type pin connectors can be connected.