| 摘要 |
<p>PURPOSE:To make the surface of a surface wiring pattern formed on one side of a unit on the same plane as that of a laminate and to prevent a laminate strain on the side of the unit by forming a conductor film which is to become an internal wiring pattern after the conductor film which is to become the surface wiring pattern is formed. CONSTITUTION:On a support substrate 15 forming a conductor film to serve as a surface wiring pattern 4 of one main surface side, a photosetting ceramic slip material is coated and printed to form a coated film 10a to serve as a ceramic layer. Next, a selective exposure, development treatment is made on the coated film 10a to form a through recessed part 30 to serve as a via hole conductor 3. Then, conductive paste is put in the through recessed part 30 to form a conductor to serve as the via hole conductor 3 and/or a conductor film 31 to serve as an internal wiring pattern 2, and the conductive paste is printed and formed on the coated film 10a. The process mentioned above is repeated in order to form a laminate 1. Subsequently, the laminate 1 including the surface wiring pattern 4 on one main surface side is removed from the support substrate 15, and the laminate 1 is baked.</p> |
