| 摘要 |
PURPOSE:To make sure insulation between inner leads and the surface of an island part and to lessen a possibility of an electrical short-circuit between the inner leads and part by a method wherein openings are provided outside a chip mount part of the island part of a lead frame member. CONSTITUTION:In a second lead frame member 12, an island part 14 is supported by suspension leads 16 stretched from an outer frame part 15 and openings 18 of a desired form are provided outside of a chip mount region, of the island part 14. Thereby, in the case where the region comprising the chip mounting part is sealed, the leads result in being pushed up from the surface of the island part 14 by a resin to intrude through the openings 18 at the time of a molding work and the state between the leads and the island part 14 becomes easy to turn into a state that the resin is interposed between the leads and the island part 14. As a result, separation of both of the leads and the island part 14 from each other and insulation between the leads and the surface of the island part 14 are made sure. Accordingly, a possibility of an electrical short-circuit between the inner leads and the island part 14 is decreased. |
