| 摘要 |
PURPOSE:To avoid breakdown of a package by hot rays heating as well as the nonconformity such as disconnection, etc., on a bonding wire, etc., by a method wherein a painting film reflecting the hot rays is provided on the package surface of a semiconductor device. CONSTITUTION:The whole surface of a package resin sealed with a semiconductor chip is coated with a paint 11 in even film thickness. A paint film coated with a paint 11 reflecting the hot rays is provided on the surface irradiated with the hot rays from a heat source at least reflow soldered. Especially, the paint 11 contains a metal reflecting infrared ray reflecting metal preferably Ag. Through these procedures, the temperature raise of this package 5 in the solder reflow process is reduced so as to suppress the cracking in the package 5 due to the heated expansion of water content in the package 5. Furthermore, the consumption of sealing resin of the package 5 by laser marking can be avoided. |
