发明名称 COOLING DEVICE FOR ELECTRONIC EQUIPMENT
摘要 PURPOSE:To provide a cooling device, which is suitable to apply to an electronic equipment provided with an electronic device which generates heat when operating. CONSTITUTION:A cooling device, which is constituted of an electronic cooling element 2 for cooling a heating unit, a heat dissipation heat pipe 4 and a metallic and elastic thermal conduction mechanism 3, which is good in heat conductivity and has a flexibility and is interposed between the element 2 and the heat pipe 4, is applied to an electronic equipment provided with an electronic device 1, which generates heat while operating.
申请公布号 JPH0817980(A) 申请公布日期 1996.01.19
申请号 JP19940143003 申请日期 1994.06.24
申请人 NIPPON HOSO KYOKAI <NHK> 发明人 EGAMI YOSHIO;YAMAZAKI JUNICHI;OKAZAKI SABURO;ANDO FUMIHIKO
分类号 H01L23/38;H01L23/427;H04N5/335;(IPC1-7):H01L23/38 主分类号 H01L23/38
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