| 摘要 |
<p>PURPOSE:To enhance an electrical connection between the electrode of a semiconductor chip and a lead in reliability by a method wherein the inner end of the lead inside a package and the electrode of the semiconductor chip are electrically connected together through the intermediary of a conductor layer provided onto the surface of an insulator. CONSTITUTION:A semiconductor device 1 is equipped with leads 3 which extend out of a package 2 from inside, wherein the inner ends of the leads 3 inside the package 2 and the electrodes of a semiconductor chip 4 are electrically connected together through the intermediary of conductor layers 16 on the surface of an insulator 15. For instance, a conductor layer 16 of required pattern is formed on the underside of an insulating film 15 of epoxy resin or the like formed as thick as 75mum or so, and the insulating film 15 is arranged facing the chip 4 and the inner ends of the leads 3 so as to spread over them. The inner ends of the conductor layers 16 are connected to gold bumps 7 located on the electrodes of the chip 4 through the intermediary of gold-tin alloy layers, and the outer ends of the conductor layers 16 are bonded to corresponding gold bumps 8 located on the inner ends of tone leads 3 through the intermediary of gold-tin alloy layers.</p> |
