发明名称 |
Method for producing field effect transistor |
摘要 |
A method for producing a field effect transistor comprises: depositing a positive photoresist 2 a semiconductor substrate 1; imagewise exposing the positive photoresist 2; converting the positive photoresist 2 into a negative photoresist and developing to form a pattern 2a having an aperture 3; wet etching the semiconductor substrate 1 using the photoresist pattern 2a as a mask to form a first recess 4; further developing the photoresist pattern 2a to remove areas 21; using the photoresist pattern 2a with the increased overhanging portions as a mask, wet etching the semiconductor substrate 1 to increase the width of the first recess 4 and to form a second recess 4a; and depositing a gate metal to form a gate electrode 5 in the second recess 4a. <IMAGE> |
申请公布号 |
GB9523245(D0) |
申请公布日期 |
1996.01.17 |
申请号 |
GB19950023245 |
申请日期 |
1993.11.08 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
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分类号 |
G03F1/00;G03F1/14;G03F7/20;H01L21/027;H01L21/285;H01L21/338 |
主分类号 |
G03F1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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