| 摘要 |
PURPOSE:To obtain the subject composition having flowability and giving a cured product excellent in crack resistance, when a moisture-absorbing solder is applied to a package for mounting a semiconductor device on its surface, by adding both two kinds of specific polysiloxanes. CONSTITUTION:This composition is produced by adding (C) an amino groupcontaining polyether-modified polysiloxane of formula I [R<1> is 1-6C monovalent hydrocarbon; R<2> is R<1>, N atom-containing monovalent organic group having an NH group; R<3> is 1-6C divalent hydrocarbon, N atom-containing divalent organic group having an NH group; but the group of formula I has one or more NH groups; Y is group of formula II (R<4> is R<1>; e/f<=1; e+f=10-50); (a) is 20-100; (b) is 1-10; (c) is 0-10; (d) is 0,1], and (D) a fine particulate silicone cured product containing diorganopolysiloxane units in an amount of >=80wt.% so that whole siloxane amount in the components C and D is 0.05-5wt.% based on the whole amount of the composition, to an epoxy resin composition comprising (A) an epoxy resin, (B) a curing agent and (C) an inorganic filler. |
