Datenträger mit einem Modul mit integriertem Schaltkreis
摘要
The electronic module (3) is bonded into a recess (15) in the body (1) of an identification card by means of resin (17) hardened by electron beam irradiation eg. through the back of the card. Contact surfaces (2) are formed on a supporting film (6) in which windows (13, 14) are made for the integrated circuit chip (8) and bond wires (7). To improve the fit of the module in its recess, the surfaces of the latter and/or the film are roughened and a tapered hole (18) is made through the film.
申请公布号
DE4423575(A1)
申请公布日期
1996.01.11
申请号
DE19944423575
申请日期
1994.07.05
申请人
GIESECKE & DEVRIENT GMBH, 81677 MUENCHEN, DE
发明人
HAGHIRI, YAHYA, 80797 MUENCHEN, DE;BARAK, RENEE LUCIA, 82008 UNTERHACHING, DE