摘要 |
The invention concerns a method of producing a three-dimensional component or group of components, particularly on surfaces of already processed <u>semiconductor chips</u>. The production of three-dimensional features on chip surfaces is based on the stucturing of thick photosensitive resists and subsequent formation of the surface features by galvanic etching. Prior art methods merely use a thick photoresist and interposed galvanic starting layers to form three-dimensional features. The production of complex features is only possible with considerable difficulty owing to the low stability of the photoresist. The method proposed for the production of three-dimensional features uses, in addition to the galvanic etching of e.g. UV-structured photoresist layers with build-on metal films (16), etching using metal auxiliary films which are later removed again (sacrificial layers) (13). These metal auxiliary films lying in the resist layers are also used, in multi-layer features, as galvanic starting layers for additional build-on levels. The three-dimensional features which can be made by the method described enable, for example, e.g. coils and transformers to be manufactured, in a form in which they could not be manufactured previously, for integration on chip surfaces.
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申请人 |
FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V., 80636 MUENCHEN, DE |
发明人 |
ROTHE, GEB. KOENIG, MARTINA, 10709 BERLIN, DE;MACIOSSEK, ANDREAS, DIPL.-ING., 10717 BERLIN, DE;LOECHEL, BERND, DR., 14197 BERLIN, DE |