发明名称 Fired body for and manufacture of a substrate
摘要 <p>A fired body (24) for manufacturing a substrate (14) is pillar shaped and includes metallic wires (10) arranged inside the fired body parallel with its axis. The melting point of the metallic wires (10) is higher than the melting point, pour point or softening point of an insulating base body (22) of the fired body. A method of manufacturing a substrate includes the steps of: forming a pillar shaped unfired body (22) in which metallic wire rods (10) having a melting point higher than the firing temperature of a fired body are embedded and parallel with the axis; firing the unfired body at a temperature higher than the melting point of the fired body; and cutting the fired body (24) in a direction perpendicular to the axis to provide a substrate (14) of a pre-determined thickness. <MATH></p>
申请公布号 EP0691682(A2) 申请公布日期 1996.01.10
申请号 EP19950304382 申请日期 1995.06.22
申请人 SHINKO ELECTRIC INDUSTRIES CO. LTD. 发明人 HORIUCHI, MICHIO, C/O SHINKO ELECT. IND. CO., LTD.;TAKEUCHI, YUKIHARU, C/O SHINKO ELECT. IND. CO.LTD.;HARAYAMA, YOICHI, C/O SHINKO ELECT. IND. CO., LTD.
分类号 C04B35/00;H01L21/48;H01L23/12;H01L23/15;H01L23/498;H05K1/03;H05K3/00;H05K3/40;(IPC1-7):H01L23/538 主分类号 C04B35/00
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