Thermoplastic molding materials based on partly aromatic copolyamides and polyolefins

摘要

Thermoplastic molding materials contain A) 4-94% by weight of a partly aromatic, semicrystalline copolyamide having a triamine content of less than 0.5% by weight and composed of (A1) 20-90% by weight of units derived from terephthalic acid and hexamethylenediamine, (A2) 0-50% by weight of units derived from epsilon -caprolactam, (A3) 0-80% by weight of units derived from adipic acid and hexametheylenediamine and (A4) 0-40% by weight of further polyamide-forming monomers, the amount of components (A2) or (A3) or (A4) or of mixtures thereof being not less than 10% by weight, B) 4-94% by weight of a polyolefin homo- or copolymer or a mixture thereof, C) 2-20% by weight of an adhesion promoter, D) 0-20% by weight of a toughening polymer and E) 0-60 % by weight of additives and processing assistants.