发明名称 THERMOSETTING COMPOSITION AND METHOD OF FORMING TOPCOATING FILM
摘要 <p>A thermosetting composition comprising (A) either a compound (A-1) having both of epoxy and reactive silicon groups as the essential functional groups in its molecule or a mixture (A-2) of an epoxy compound with a reactive silicon compound and (B) an organotin catalyst; another thermosetting composition comprising (A) either a compound (A-3) having all of an epoxy group (i), a reactive silicon group (ii) and a hydroxyl and/or carboxyl group (iii) as the essential functional groups in its molecule or a mixture (A-4) which comprises at least two types of compound each having at least one of the above functional groups (i) to (iii) in its molecule and wherein all of the above functional groups (i) to (iii) are present and (B) an organotin catalyst; and a method of forming a topcoating film from these compositions. The compositions are excellent in storage stability and can be cured at low temperature to give a discoloration-free cured article. The method gives a topcoating film excellent in low-temperature curability, appearance, and resistances to acids, scuff marks and weathering.</p>
申请公布号 WO1995035336(P1) 申请公布日期 1995.12.28
申请号 JP1995001198 申请日期 1995.06.15
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