Encased integral molded plastic multi-chip module substrate and fabrication process

摘要

A method for fabricating a multi-chip module substrate comprises providing a carrier (10) having a well. Substrate molding material (18) is poured into the carrier well (12). A plurality of chips (20) is situated in the substrate molding material. A laminatable dielectric layer (26) is laminated over the substrate molding material at a predetermined temperature and a predetermined pressure so that the substrate molding material (18) flows and encapsulates the chips (20).