METHOD OF RESIN-SEALING SEMICONDUCTOR DEVICES

摘要

The method according to the present invention is carried out by setting a circuit board (9), on which an IC 15 is mounted, in a cavity (11) of a lower metal mold (2) so that the IC faces in the downward direction, feeding a resin tablet (19) from a pot (21) formed in a position lower than the cavity (11), pressing a molten resin with a plunger (20) and packing the resin in the cavity (11) through a runner (18) and a pinpoint gate formed at a lower portion of the cavity, and pressing a rear surface of the circuit board (9) with a pressing member (3) provided in an upper metal mold, whereby the IC 15 mounted on the circuit board (9) is resin-sealed. Consequently, the present invention makes it possible to prevent the occurrence of residual resin which causes the imperfect packing of the cavity with a resin, improve the productivity of semiconductor devices, and mold semiconductor devices having a high reliability and a high quality.