| 摘要 |
The device consists of 2 splined clamps (17) and (19,20), of which (19) and (20) form the upper and lower gripping surfaces which have interlocking convex and concave grip and of which (17) represents a similar such pair. Each pair is applied to one edge of the tape which is also drawn from source roller (1) and tensioned in the down-web direction along further rollers (7,8,9,11,16) using driving device (5). The clamps are positioned and thus also tape is tensioned in the cross-web direction by driving device (18) moving clamps away from each other, to a tension value substantially equal to that of the down-web direction, after which the semiconductor wafer (3) set in a frame (4) is attached from below. The stepping motor (25) may be computer controlled to allow tension to be altered for various types of tape.
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