Laminierungsverfahren zum Überdecken der Seitenwände einer Höhlung in einem Substrat sowie zur Füllung dieser Höhlung.

摘要

Method for pressing a material (6,8,84) into a through-hole (12) or blind-hole (80) in a substrate (10,82). The material (6,8,84) is disposed on the surface of the substrate (10,82). An environment is provided permitting the material (6,8,84) to flow for example by heating the material (6,8,84) to the glass transition temperature or above. Thereafter pressure is applied causing the material (6,8,84) to flow, first coating the sidewall (18,92) of the hole (12,80) and on the continued application of pressure the material flows to completely fill the hole (12,80). The resulting substrate (10,82) can have a substantially planar surface having holes (12,80) with the periphery coated with or completely filled with the material (6,8,84). The material (6,8,84) is preferably a thermoplastic polymeric material such as a polyimide and a perfluorinated polymer.